Dscoop North America 2014 - Brake The Mold

ORLANDO, FLORIDA, USA - 2014-03-06
Meccanotecnica/Book Automation is a featured exhibitor at Dscoop9, a three-day educational and networking conference for HP Graphic Arts customers.

Break the Mold is more than a tagline. The Dscoop philosophy is about brainstorming "out of the box" solutions to take your business to the next level and re-energizing your passion for print with innovative ideas.

When? March 6-8, 2014 in Orlando, Florida

Where? In the Ruby Partner Pavillion, Book Automation booth #935, at Gaylord Palms Resort & Conventional Center, Kissimee, FLORIDA.

What? Stop by our booth to meet with our experts and take a look at our latest UNIVERSE DIGITALINE products:

• New UNIVERSE SEWING (watch HERE the VIDEO)
• New UNIVERSE INLINE

Why Should You Attend?

Only Dscoop9 offers the quality of educational sessions that you’ve come to expect, the amount of networking and sharing opportunities with your peers, and the Partners working exclusively with HP equipment and related solutions who are dedicated to helping you grow.

  • Learn from high-profile subject matter experts on marketing and branding, decision-making and leadership, sales training and strategy, and more
  • The opportunity to attend all sessions in one track or mix and match based on your needs among business and sales, operations, label and packaging, and grand format
  • Get your questions answered by peers and HP experts
  • Discover the latest substrates, software solutions and technologies in the Solutions Showcase

How Can You Attend?

Register online today HERE! You must be a Dscoop member to attend the conference. Learn more about renewing or joining Dscoop.